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Conferences
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"Suction Pressure Modeling for Rolling Piston Compressors", V.V. Lenchine, J.W. Seok, J.M. Joo and
S. K. Oh, Internoise 2004, The 33rd International Congress and Exposition on Noise Control
Engineering, Prague, Czech Republic, August 22-25, 2004, Paper No. 564.
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"Developing the Structure of a Cu CMP Model", Jongwon Seok, C. P. Sukam, L. Borucki, A. Jindal, J.
A. Tichy, R. J. Gutmann and T. S. Cale, IEEE International Conference on Simulation of Semiconductor
Processes and Devices (SISPAD), September 3-5, 2003, Boston Marriott Cambridge, Cambridge, MA,
ISBN 0780378261, pp. 303-306.
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"Integrated Multiscale and Multistep Process Simulation", M. O. Bloomfield, Y. H. Im, Jongwon Seok,
C. P. Sukam, J. A. Tichy and T. S. Cale, Proceedings of the Eighth International CMP-MIC Conference,
Thomas E. Wade (Ed) IMIC, February 19-21, 2003, Santa Clara, California, pp. 463-472.
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"Integrated Multiscale Multistep Process Simulation: [Part II]", Y. H. Im, M. O. Bloomfield, Jongwon
Seok, C. P. Sukam, J, A. Tichy and T. S. Cale, IEEE International Conference on Simulation of
Semiconductor Processes and Devices (SISPAD), September 3-5, 2003, Boston Marriott Cambridge,
Cambridge, MA, ISBN 0780378261, pp. 307-310.
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"An Integrated Multiscale Chemical Mechanical Planarization Model for Patterned Wafers with Surface
Evolution", C, P. Sukam, Jongwon Seok, A. T. Kim, J. A. Tichy and T. S. Cale, Fourth International
Conference on Microelectronics and Interfaces (ICMI), March 3-6, 2003, Santa Clara Convention
Center, Santa Clara, California, Proceedings in press.
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"A Multiscale Mechanical CMP Model for Patterned Wafers", Jongwon Seok, Cyriaque P. Sukam,
Andrew T. Kim, John A, Tichy, and Timothy S. Cale, in Thin Film Materials, Processes, and Reliability G.
S. Mathad, T. S. Cale, D. Collins, M. Engelhardt, F. Leverd, and H. S. Rathore, eds., ECS PV 2003-13
ECS, 2003, pp. 256-265.
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"Integrated Multiscale Process Simulation of Damascene Structures", M. O. Bloomfield, Y. H, Im,
Jongwon Seok, C. P. Sukam, J. A. Tichy and T. S. Cale, 203rd Meeting of the Electrochemical Society
(ECS), PV 2003-06 ULSI Process Integration III , C. Claeys, F. Gonzalez, R. Singh, J. Murota, and P.
Fazan (Eds), April 27-May 2, 2003, Paris, France, pp. 455-466
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"(invited) Integrated Multiscale Process Simulation", T. S. Cale, M. O. Bloomfield, Jongwon Seok, C.
P. Sukam, and J. A. Tichy, 19th international VLSI Multilevel Interconnection Conference (VMIC),
Thomas E. Wade (Ed.), IMIC, November 18-20, 2002, Singapore, invited paper, pp. 213-222.
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"Modeling of Material Removal for Fixed Abrasive CMP: Blanket Wafers", C. P. Sukam, Jongwon Seok,
A. T. Kim, J. A. Tichy and T. S. Cale, Proceedings of the Walter Lincoln Hawkins Graduate Research
Conference 2002, October 17, 2002, Troy, New-York, pp. 27-32.
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"An Integrated Multiscale Mechanical Model for Chemical Mechanical Planarization", Jongwon Seok, C.
P. Sukam, A. T. Kim, J. A. Tichy and T. S. Cale, Advanced Metallization Conference (AMC) in 2002,
MRS, October 1-3, 2002, San Diego, California, pp. 109-114.
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"A Statistical Integrated Multiscale CMP Model With Feature Scale Evolution", Cyriaque P. Sukam,
Jongwon Seok, Andrew T. Kim, John A. Tichy and Timothy S. Cale, in Semiconductor Technology
(ISTC2002), Proceedings of the 2nd International Conference on Semiconductor Technology, M. Yang,
ed., ECS PV 2002-17, ECS, 2002, pp. 463-475,
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"(invited) Multiscale Mechanical Modeling of CMP", Jongwon Seok, C. P. Sukam, A. T. Kim, J. A.
Tichy and T. S. Cale, in Chemical Mechanical Planizaration V, Proceedings of the ECS 2002 Centennial
(201st) Meeting, V, S. Seal, R. L, Opila, C. Reidsema Simpson, K. Sundaram, H. Huff, and I, I. Suni,
Editors, The Electrochemical Society Proceedings Series, Pennington, NJ, May 12-17, 2002,
Philadelphia, Pennsylvania, invited paper, pp. 210-224.
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