International

1.      Lubrication characteristics of a plane porous bearing sliding on textured surface, Sooyoung Lee, Jongwon Seok, The 5th International Congress on Natural Science and Engineering, May, 2014, Kyoto, Japan.

2.      Aerodynamic effect of 3D pattern on airfoil, Xiao Yu Wang, Sooyoung Lee, Pilkee Kim, Jongwon Seok, The 3rd International Conference on Engineering and Technology Innovation, October, 2014, Kenting, Taiwan.

3.       Nonlinear behaviors of a cantilever beam type piezoelectric energy harvester with multi-stable potential well structure, Pilkee Kim, Jeehyun Jung, Jung-In Lee, Sooyoung Lee, Jongwon Seok, The 3rd Japan-Korea Joint Symposium on Dynamics & Control, August, 2013, Fukuoka, Japan.

4.      Development of a Mechanical Energy Harvester Based on Broad-Band and Large-Amplitude Vibration, Pilkee Kim, Jeehyun Jung, Sooyoung Lee, Jongwon Seok, 15th Asia Pacific Vibration Conference, June, 2013, Jeju, Korea.

5.      Free Flexural Vibrations of a Piezoelectric Bimorph Plate with Periodic Edge Conditions, Pilkee Kim, Jeehyun Jung, Jongwon Seok, The 2nd International Conference on Engineering and Technology Innovation, November, 2012, Kaohsiung, Taiwan.

6.      A dynamic analysis on micro-turning process considering state dependent, large time delay, Pilkee Kim, Jeehyun Jung, Jongwon Seok, The 7th International Workshop on Microfactories, October, 2010, Daejeon, Korea.

7.      "A dynamic analysis on the contaminant particles' removal mechanism in cryogenic carbon dioxde (CO2) cleaning process", Seonghoon Lee, Pilkee Kim, Jongwon Seok, e-Science AHM 2008, September, 2008, Daejeon, Korea, pp. 104-106.

8.      "Parametric Study of a Magnetoirheological Fluid in a Finishing Process for Hard Materials", Seonghoon Lee, Bongsu Jung, Jongwon Seok, International Conference on Smart Manufacturing Application (ICSMA), April. 9-11, 2008, KINTEX, Gyeonggi-do, Korea, pp. 243-246.

9.      "A 3-D model for magnetorheological fluid considering neighboring particle interactions in 2-D skewed magnetic field", Kyung-In Jang, Jongwon Seok, Byung-Kwon Min, Sang Jo Lee, Proceeding of Asian Symposium for Precision Engineering and Nanotechnology(ASPEN), November, 2007, KwangJoo, Korea, pp. 544-548.

10.    "A Material Removal Model for Chemical Mechanical Polishing Considering Complementary Chemical-Mechenical Effects", Seunghee Oh, Jongwon Seok, ASME McMAT 2007 , June, 2007, Texas, USA, 30248.

11.    "An Analysis of an Annular Polar Orthotropic Bimorph Plate with Periodically Built-In Edge Conditions", Young Sik Kim, Jongwon Seok, ASME McMAT 2007 , June, 2007, Texas, USA, 30238.

12.    "A Dynamic Analysis on the Collision Between Particles for CO2 Snow Cleaning", Pilkee Kim, Jongwon Seok, ASME McMAT 2007 , June, 2007, Texas, USA, 30611.

13.    "Suction Pressure Modeling for Rolling Piston Compressors", V.V. Lenchine, J.W. Seok, J.M. Joo and S. K. Oh, Internoise 2004, The 33rd International Congress and Exposition on Noise Control Engineering, Prague, Czech Republic, August 22-25, 2004, Paper No. 564.

14.    "Developing the Structure of a Cu CMP Model", Jongwon Seok, C. P. Sukam, L. Borucki, A. Jindal, J. A. Tichy, R. J. Gutmann and T. S. Cale, IEEE International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), September 3-5, 2003, Boston Marriott Cambridge, Cambridge, MA, ISBN 0780378261, pp. 303-306.

15.    "Integrated Multiscale and Multistep Process Simulation", M. O. Bloomfield, Y. H. Im, Jongwon Seok, C. P. Sukam, J. A. Tichy and T. S. Cale, Proceedings of the Eighth International CMP-MIC Conference, Thomas E. Wade (Ed) IMIC, February 19-21, 2003, Santa Clara, California, pp. 463-472.

16.    "Integrated Multiscale Multistep Process Simulation: [Part II]", Y. H. Im, M. O. Bloomfield, Jongwon Seok, C. P. Sukam, J. A. Tichy and T. S. Cale, IEEE International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), September 3-5, 2003, Boston Marriott Cambridge, Cambridge, MA, ISBN 0780378261, pp. 307-310.

17.    "An Integrated Multiscale Chemical Mechanical Planarization Model for Patterned Wafers with Surface Evolution", C. P. Sukam, Jongwon Seok, A. T. Kim, J. A. Tichy and T. S. Cale, Fourth International Conference on Microelectronics and Interfaces (ICMI), March 3-6, 2003, Santa Clara Convention Center, Santa Clara, California, Proceedings in press.

18.    "A Multiscale Mechanical CMP Model for Patterned Wafers", Jongwon Seok, Cyriaque P. Sukam, Andrew T. Kim, John A. Tichy, and Timothy S. Cale, in Thin Film Materials, Processes, and Reliability G. S. Mathad, T. S. Cale, D. Collins, M. Engelhardt, F. Leverd, and H. S. Rathore, eds., ECS PV 2003-13, ECS, 2003, pp. 256-265.

19.    "Integrated Multiscale Process Simulation of Damascene Structures", M. O. Bloomfield, Y. H. Im, Jongwon Seok, C. P. Sukam, J. A. Tichy and T. S. Cale, 203rd Meeting of the Electrochemical Society (ECS), PV 2003-06 ULSI Process Integration III , C. Claeys, F. Gonzalez, R. Singh, J. Murota, and P. Fazan (Eds), April 27-May 2, 2003, Paris, France, pp. 455-466.

20.    "(invited) Integrated Multiscale Process Simulation", T. S. Cale, M. O. Bloomfield, Jongwon Seok, C. P. Sukam, and J. A. Tichy, 19th international VLSI Multilevel Interconnection Conference (VMIC), Thomas E. Wade (Ed.), IMIC, November 18-20, 2002, Singapore, invited paper, pp. 213-222.

21.    "Modeling of Material Removal for Fixed Abrasive CMP: Blanket Wafers", C. P. Sukam, Jongwon Seok, A. T. Kim, J. A. Tichy and T. S. Cale, Proceedings of the Walter Lincoln Hawkins Graduate Research Conference 2002, October 17, 2002, Troy, New-York, pp. 27-32.

22.    "An Integrated Multiscale Mechanical Model for Chemical Mechanical Planarization", Jongwon Seok, C. P. Sukam, A. T. Kim, J. A. Tichy and T. S. Cale, Advanced Metallization Conference (AMC) in 2002, MRS, October 1-3, 2002, San Diego, California, pp. 109-114.

23.    "A Statistical Integrated Multiscale CMP Model With Feature Scale Evolution", Cyriaque P. Sukam, Jongwon Seok, Andrew T. Kim, John A. Tichy and Timothy S. Cale, in Semiconductor Technology (ISTC2002), Proceedings of the 2nd International Conference on Semiconductor Technology, M. Yang, ed., ECS PV 2002-17, ECS, 2002, pp. 463-475.

24.    "(invited) Multiscale Mechanical Modeling of CMP", Jongwon Seok, C. P. Sukam, A. T. Kim, J. A. Tichy and T. S. Cale, in Chemical Mechanical Planizaration V, Proceedings of the ECS 2002 Centennial (201st) Meeting, V, S. Seal, R. L. Opila, C. Reidsema Simpson, K. Sundaram, H. Huff, and I. I. Suni, Editors, The Electrochemical Society Proceedings Series, Pennington, NJ, May 12-17, 2002, Philadelphia, Pennsylvania, invited paper, pp. 210-224.

25.    "Modeling of Material Removal for Fixed Abrasive CMP", C. P. Sukam, Jongwon Seok, A. T. Kim, J. A. Tichy and T. S. Cale, Proceedings of the Seventh International CMP-MIC Conference, Thomas E. Wade (Ed) IMIC, February 27-March 1, 2002, Santa Clara, California, pp. 85-88.

26.    "Modeling of the Material Removal for Chemical Mechanical Planarization", C. P. Sukam, Jongwon Seok, A. T. Kim, J. A. Tichy and T. S. Cale, Proceedings of the AVS Third International Conference on Microelectronics and Interfaces, Calvin T. Gabriel (Ed) IMIC, February 11-15, 2002, Santa Clara Convention Center, Santa Clara, California, pp. 79-81.

27.    "A Multiscale Model for Chemical Mechanical Planarization", A. T. Kim, Jongwon Seok, C. P. Sukam, J. A. Tichy and T. S. Cale, Proceedings of the Advanced Metallization Conference (AMC) in 2001, Andrew McKerrow, Yosi Shacham-Diamand, Shigeaki Zaima, Takayuki Ohba (Eds), MRS, October 9-11, 2001, Montreal, Canada, pp. 405-410.

28.    "Soft Elastohydrodynamic Lubrication With Roughness", A. T. Kim, Jongwon Seok, J. A. Tichy and T. S. Cale, Proceedings of 2002 ASME/STLE Joint International Tribology Conference, Oct. 27-30, 2002, Cancun, Mexico, 2002-TRIB-132.

29.    "A Multiscale Contact Mechanics and Hydrodynamics Model of Chemical Mechanical Polishing", A. T. Kim, Jongwon Seok, J. A. Tichy and T. S. Cale, 18th international VLSI Multilevel Interconnection Conference (VMIC), Thomas E. Wade (Ed.), IMIC, November 27-30, 2001, Santa Clara, California, pp. 129-134.

30.    "A Study on the Fatigue Failure of Valve System in Rotary Compressor", J. Y. Bae, J. W. Suk, Y. C. Ma, K. S. Im, Proceedings of the 1994 International Compressor Engineering Conference at Purdue, Werner Soedel (Ed.), July 19-22, 1994, Purdue, Illinois, pp. 409-414.